- icamr@sciei.org
- +1-562-606-1057/+861-820-7777775
- Mon - Fri 9:30am-18:00pm
Conference proceeding would be published
by Materials Science Forum (MSF). ISBN: 978-3-0357-1637-5 Vol. 1060
Online:
https://www.scientific.net/MSF.1060
Index:
SCOPUS
This year, the conference invite three keynote speakers and three invite speakers. They are
Keynote Speech I Prof. Zhongfan Liu, Peking University, China Mass Production Technology of CVD Graphene Materials for Setting the Cornerstone of Graphene Industry |
Keynote Speech II Prof. Alan Lau, Swinburne University of Technology, Australia Aircraft Composite Repair - Fundamental to Structural Health Monitoring |
Keynote Speech III Prof. Jong Hak Kim, Yonsei University, South Korea Graft Copolymer for Membranes and Supercapacitors |
Invite Speech I Assoc. Prof. Teik-Cheng Lim, Singapore University of Social Sciences, Singapore Mechanical metamaterials with sign toggling properties |
Invite Speech II Dr. Seok-Keun Koh, DaeMyung TS, South Korea Antimicrobial Nanocomposites by the Nanoparticles on Powder (NPP) Process and its Current Status |
Invite Speech III Dr. Qiaoyuan Deng, Hainan University, China Cu Ion Promote the Formation of Carbonaceous Films on the Articulating Surface of Artificial Joints |
R1004
Paper Title: Characterization
of interfacial bonding properties of Vitrimer epoxy/
T700 carbon fiber by
microdrop test
Heshan Bai, Tianyu Zhao, Ruixiang Bai,
Zhenkun Lei, Chen Liu
Dalian University of Technology, China
R1028
Paper Title: Effective medium analysis of stacked-nanoparticles
array’s optical responses
Muhammad Tegar Pambudi, Priastuti
Wulandari, Alexander A. Iskandar
ITB, Indonesia
R1018-A
Paper Title: Simultaneously
enhancing strength and ductility in graphene
nanoplatelets
reinforced Ti6Al4V composites via selective laser
melting of core-shell powders
Weijia Ren, Mabao Liu, Wei Zhang
Xi’an Jiaotong University, China
R1004
Paper Title: Characterization
of interfacial bonding properties of Vitrimer epoxy/
T700 carbon fiber by
microdrop test
Heshan Bai, Tianyu Zhao, Ruixiang Bai,
Zhenkun Lei, Chen Liu
Dalian University of Technology, China
More and original, please mail icamr@sciei.org.